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EP7309 Data Sheet
FEATURES
ARM720T Processor -- ARM7TDMI CPU -- 8 KB of four-way set-associative cache -- MMU with 64-entry TLB -- Thumb code support enabled Ultra low power -- 90 mW at 74 MHz typical -- 30 mW at 18 MHz typical -- 10 mW in the Idle State -- <1 mW in the Standby State Advanced audio decoder/decompression capability -- Supports bit streams with adaptive bit rates -- Allows for support of multiple audio decompression algorithms (MP3, WMA, AAC, ADPCM, Audible, etc.)
High-performance, Low-power, System-on-chip with Enhanced Digital Audio Interface
OVERVIEW
The MaverickTM EP7309 is designed for ultra-low-power applications such as digital music players, internet appliances, smart cellular phones or any hand-held device that features the added capability of digital audio decompression. The corelogic functionality of the device is built around an ARM720T processor with 8 KB of four-way set-associative unified cache and a write buffer. Incorporated into the ARM720T is an enhanced memory management unit (MMU) which allows for support of sophisticated operating systems like Microsoft(R) Windows(R) CE and Linux(R).
(cont.)
(cont.)
BLOCK DIAGRAM
Digital Audio Interface Power Management
EPB Bus
Clocks & Timers
ICE-JTAG
USER INTERFACE
SERIAL PORTS
Serial Interface
ARM720T
ARM7TDMI CPU Core
Interrupts, PWM & GPIO
(2) UARTs w/ IrDA Internal Data Bus
Boot ROM
8 KB Write Cache Buffer MMU
Bus Bridge
Keypad& Touch Screen I/F
MaverickKeyTM
SRAM & FLASH I/F
On-chip SRAM 48 KB
LCD Controller
MEMORY AND STORAGE
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AUG `05 DS507F1
EP7309 High-Performance, Low-Power System on Chip
FEATURES (cont)
Dynamically programmable clock speeds of 18, 36, 49, and 74 MHz 48 KB of on-chip SRAM MaverickKeyTM IDs -- 32-bit unique ID can be used for SDMI compliance -- 128-bit random ID LCD controller -- Interfaces directly to a single-scan panel monochrome STN LCD -- Interfaces to a single-scan panel color STN LCD with minimal external glue logic Full JTAG boundary scan and Embedded ICE(R) support Integrated Peripheral Interfaces -- 8/32/16-bit SRAM/FLASH/ROM Interface -- Digital Audio Interface providing glueless interface to low-power DACs, ADCs and CODECs -- Two Synchronous Serial Interfaces (SSI1, SSI2) -- CODEC Sound Interface -- 8x8 Keypad Scanner -- 27 General Purpose Input/Output pins -- Dedicated LED flasher pin from the RTC Internal Peripherals -- Two 16550 compatible UARTs -- IrDA Interface -- Two PWM Interfaces -- Real-time Clock -- Two general purpose 16-bit timers -- Interrupt Controller -- Boot ROM Package -- 208-Pin LQFP -- 256-Ball PBGA -- 204-Ball TFBGA The fully static EP7309 is optimized for low power dissipation and is fabricated on a 0.25 micron CMOS process
OVERVIEW (cont.)
The EP7309 is designed for ultra-low-power operation. Its core operates at only 2.5 V, while its I/O has an operation range of 2.5 V-3.3 V. The device has three basic power states: operating, idle and standby. MaverickKey unique hardware programmed IDs are a solution to the growing concern over secure web content and commerce. With Internet security playing an important role in the delivery of digital media such as books or music, traditional software methods are quickly becoming unreliable. The MaverickKey unique IDs provide OEMs with a method of utilizing specific hardware IDs such as those assigned for SDMI (Secure Digital Music Initiative) or any other authentication mechanism. The EP7309 integrates an interface to enable a direct connection to many low cost, low power, high quality audio converters. In particular, the DAI can directly interface with the Crystal CS43L41/42/43 low-power audio DACs and the Crystal CS53L32 low-power ADC. Some of these devices feature digital bass and treble boost, digital volume control and compressor-limiter functions.
Simply by adding desired memory and peripherals to the highly integrated EP7309 completes a low-power system solution. All necessary interface logic is integrated on-chip.
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EP7309 High-Performance, Low-Power System on Chip
Table of Contents
FEATURES...................................................................................................................................................................1 OVERVIEW ..................................................................................................................................................................1
Processor Core - ARM720T ..................................................................................................................................6 Power Management ..............................................................................................................................................6 MaverickKeyTM Unique ID ......................................................................................................................................6 Memory Interfaces .................................................................................................................................................6 Digital Audio Capability .........................................................................................................................................6 Universal Asynchronous Receiver/Transmitters (UARTs) .....................................................................................6 Digital Audio Interface (DAI) ..................................................................................................................................7 CODEC Interface ..................................................................................................................................................7 SSI2 Interface ........................................................................................................................................................7 Synchronous Serial Interface ................................................................................................................................8 LCD Controller .......................................................................................................................................................8 Interrupt Controller ................................................................................................................................................8 Real-Time Clock ....................................................................................................................................................8 PLL and Clocking ..................................................................................................................................................9 DC-to-DC converter interface (PWM) ....................................................................................................................9 Timers ...................................................................................................................................................................9 General Purpose Input/Output (GPIO) ..................................................................................................................9 Hardware debug Interface .....................................................................................................................................9 Internal Boot ROM ...............................................................................................................................................10 Packaging ............................................................................................................................................................10 Pin Multiplexing ...................................................................................................................................................10 System Design ....................................................................................................................................................11
ELECTRICAL SPECIFICATIONS ......................................................................................................12
Absolute Maximum Ratings .................................................................................................................................12 Recommended Operating Conditions .................................................................................................................12 DC Characteristics ..............................................................................................................................................12
Timings ...............................................................................................................................................14
Timing Diagram Conventions ....................................................................................................................14 Timing Conditions ......................................................................................................................................14 Static Memory .....................................................................................................................................................15 Static Memory Single Read Cycle .............................................................................................................16 Static Memory Single Write Cycle .............................................................................................................17 Static Memory Burst Read Cycle ...............................................................................................................18 Static Memory Burst Write Cycle ...............................................................................................................19 SSI1 Interface ......................................................................................................................................................20 SSI2 Interface ......................................................................................................................................................21 LCD Interface ......................................................................................................................................................22 JTAG Interface .....................................................................................................................................................23
Packages ............................................................................................................................................24
208-Pin LQFP Package Characteristics ..............................................................................................................24 208-Pin LQFP Package Specifications ......................................................................................................24 208-Pin LQFP Pin Diagram .......................................................................................................................25 208-Pin LQFP Numeric Pin Listing ............................................................................................................26 204-Ball TFBGA Package Characteristics ...........................................................................................................29 204-Ball TFBGA Package Specifications ..................................................................................................29 204-Ball TFBGA Pinout (Top View) ...........................................................................................................30
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EP7309 High-Performance, Low-Power System on Chip
204-Ball TFBGA Ball Listing ...................................................................................................................... 31 256-Ball PBGA Package Characteristics ............................................................................................................ 38 256-Ball PBGA Package Specifications .................................................................................................... 38 256-Ball PBGA Pinout (Top View)) ............................................................................................................ 39 256-Ball PBGA Ball Listing ........................................................................................................................ 39 JTAG Boundary Scan Signal Ordering ............................................................................................................... 43
CONVENTIONS ................................................................................................................................. 48
Acronyms and Abbreviations .............................................................................................................................. 48 Units of Measurement ......................................................................................................................................... 48 General Conventions .......................................................................................................................................... 49 Pin Description Conventions ............................................................................................................................... 49 49
Ordering Information ....................................................................................................................... 50 Environmental, Manufacturing, & Handling Information .............................................................. 50 Revision History ............................................................................................................................... 51
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EP7309 High-Performance, Low-Power System on Chip
List of Figures
Figure 1. A Maximum EP7309 Based System ..............................................................................................................11 Figure 2. Legend for Timing Diagrams .........................................................................................................................14 Figure 3. Static Memory Single Read Cycle Timing Measurement ...............................................................................16 Figure 4. Static Memory Single Write Cycle Timing Measurement ...............................................................................17 Figure 5. Static Memory Burst Read Cycle Timing Measurement ................................................................................18 Figure 6. Static Memory Burst Write Cycle Timing Measurement ................................................................................19 Figure 7. SSI1 Interface Timing Measurement .............................................................................................................20 Figure 8. SSI2 Interface Timing Measurement .............................................................................................................21 Figure 9. LCD Controller Timing Measurement ............................................................................................................22 Figure 10. JTAG Timing Measurement .........................................................................................................................23 Figure 11. 208-Pin LQFP Package Outline Drawing ....................................................................................................24 Figure 12. 208-Pin LQFP (Low Profile Quad Flat Pack) Pin Diagram ..........................................................................25 Figure 13. 204-Ball TFBGA Package ............................................................................................................................29 Figure 14. 256-Ball PBGA Package ..............................................................................................................................38
List of Tables
Table 1. Power Management Pin Assignments ..............................................................................................................6 Table 2. Static Memory Interface Pin Assignments ........................................................................................................6 Table 3. Universal Asynchronous Receiver/Transmitters Pin Assignments ...................................................................7 Table 4. DAI Interface Pin Assignments .........................................................................................................................7 Table 5. CODEC Interface Pin Assignments ..................................................................................................................7 Table 6. SSI2 Interface Pin Assignments .......................................................................................................................7 Table 7. Serial Interface Pin Assignments ......................................................................................................................8 Table 8. LCD Interface Pin Assignments ........................................................................................................................8 Table 9. Keypad Interface Pin Assignments ...................................................................................................................8 Table 10. Interrupt Controller Pin Assignments ..............................................................................................................8 Table 11. Real-Time Clock Pin Assignments ..................................................................................................................9 Table 12. PLL and Clocking Pin Assignments ................................................................................................................9 Table 13. DC-to-DC Converter Interface Pin Assignments .............................................................................................9 Table 14. General Purpose Input/Output Pin Assignments ............................................................................................9 Table 15. Hardware Debug Interface Pin Assignments ..................................................................................................9 Table 16. LED Flasher Pin Assignments ........................................................................................................................9 Table 17. DAI/SSI2/CODEC Pin Multiplexing ...............................................................................................................10 Table 18. Pin Multiplexing .............................................................................................................................................10 Table 19. 208-Pin LQFP Numeric Pin Listing ...............................................................................................................26 Table 20. 204-Ball TFBGA Ball Listing .........................................................................................................................31 Table 21. 256-Ball PBGA Ball Listing ...........................................................................................................................39 Table 22. JTAG Boundary Scan Signal Ordering .........................................................................................................43 Table 23. Acronyms and Abbreviations ........................................................................................................................48 Table 24. Unit of Measurement .....................................................................................................................................48 Table 25. Pin Description Conventions .........................................................................................................................49
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EP7309 High-Performance, Low-Power System on Chip
Processor Core - ARM720T
The EP7309 incorporates an ARM 32-bit RISC microcontroller that controls a wide range of on-chip peripherals. The processor utilizes a three-stage pipeline consisting of fetch, decode and execute stages. Key features include: * * * * ARM (32-bit) and Thumb (16-bit compressed) instruction sets Enhanced MMU for Microsoft Windows CE and other operating systems 8 KB of 4-way set-associative cache. Translation Look Aside Buffers with 64 Translated Entries
Both a specific 32-bit ID as well as a 128-bit random ID is programmed into the EP7309 through the use of laser probing technology. These IDs can then be used to match secure copyrighted content with the ID of the target device the EP7309 is powering, and then deliver the copyrighted information over a secure connection. In addition, secure transactions can benefit by also matching device IDs to server IDs. MaverickKey IDs provide a level of hardware security required for today's Internet appliances.
Memory Interfaces
The EP7309 is equiped with a ROM/SRAM/FLASH-style interface that has programmable wait-state timings and includes burst-mode capability, with six chip selects decoding six 256 MB sections of addressable space. For maximum flexibility, each bank can be specified to be 8-, 16-, or 32-bits wide. This allows the use of 8-bit-wide boot ROM options to minimize overall system cost. The on-chip boot ROM can be used in product manufacturing to serially download system code into system FLASH memory. To further minimize system memory requirements and cost, the ARM Thumb instruction set is supported, providing for the use of high-speed 32-bit operations in 16-bit op-codes and yielding industry-leading code density.
Pin Mnemonic
nCS[5:0] A[27:0] D[31:0] nMOE nMWE
Power Management
The EP7309 is designed for ultra-low-power operation. Its core operates at only 2.5 V, while its I/O has an operation range of 2.5 V-3.3 V allowing the device to achieve a performance level equivalent to 60 MIPS. The device has three basic power states: * Operating -- This state is the full performance state. All the clocks and peripheral logic are enabled. * Idle -- This state is the same as the Operating State, except the CPU clock is halted while waiting for an event such as a key press. * Standby -- This state is equivalent to the computer being switched off (no display), and the main oscillator shut down. An event such as a key press can wake-up the processor.
I/O
O O I/O O O O O O
Pin Description
Chip select out Address output Data I/O ROM expansion OP enable ROM expansion write enable Halfword access select output Word access select output Transfer direction
Pin Mnemonic
BATOK nEXTPWR nPWRFL nBATCHG
I/O
I I I I
Pin Description
Battery ok input
HALFWORD WORD
External power supply sense input Power fail sense input Battery changed sense input
WRITE
Table 2. Static Memory Interface Pin Assignments
Table 1. Power Management Pin Assignments
Digital Audio Capability
The EP7309 uses its powerful 32-bit RISC processing engine to implement audio decompression algorithms in software. The nature of the on-board RISC processor, and the availability of efficient C-compilers and other software development tools, ensures that a wide range of audio decompression algorithms can easily be ported to and run on the EP7309
MaverickKey
TM
Unique ID
MaverickKey unique hardware programmed IDs are a solution to the growing concern over secure web content and commerce. With Internet security playing an important role in the delivery of digital media such as books or music, traditional software methods are quickly becoming unreliable. The MaverickKey unique IDs provide OEMs with a method of utilizing specific hardware IDs such as those assigned for SDMI (Secure Digital Music Initiative) or any other authentication mechanism.
Universal Asynchronous Receiver/Transmitters (UARTs)
The EP7309 includes two 16550-type UARTs for RS-232 serial communications, both of which have two 16-byte FIFOs for receiving and transmitting data. The UARTs support bit
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
rates up to 115.2 kbps. An IrDA SIR protocol encoder/decoder can be optionally switched into the RX/TX signals to/from UART 1 to enable these signals to drive an infrared communication interface directly.
Pin Mnemonic
TXD[1] RXD[1] CTS DCD DSR TXD[2] RXD[2] LEDDRV PHDIN
communications systems. The CODEC interface multiplexed to the same pins as the DAI and SSI2.
Pin Mnemonic
PCMCLK PCMOUT
is
I/O
O O I O
Pin Description
Serial bit clock Serial data out Serial data in Frame sync
I/O
O I I I I O I O I
Pin Description
UART 1 transmit
PCMIN UART 1 receive PCMSYNC UART 1 clear to send UART 1 data carrier detect UART 1 data set ready UART 2 transmit UART 2 receive Infrared LED drive output Photo diode input Note:
Table 5. CODEC Interface Pin Assignments See Table 17 on page 10 for information on pin multiplexes.
SSI2 Interface
An additional SPI/Microwire1-compatible interface is available for both master and slave mode communications. The SSI2 unit shares the same pins as the DAI and CODEC interfaces through a multiplexer. * * * * Synchronous clock speeds of up to 512 kHz Separate 16 entry TX and RX half-word wide FIFOs Half empty/full interrupts for FIFOs Separate RX and TX frame sync signals for asymmetric traffic
Table 3. Universal Asynchronous Receiver/Transmitters Pin Assignments
Digital Audio Interface (DAI)
The EP7309 integrates an interface to enable a direct connection to many low cost, low power, high quality audio converters. In particular, the DAI can directly interface with the Crystal CS43L41/42/43 low-power audio DACs and the Crystal CS53L32 low-power ADC. Some of these devices feature digital bass and treble boost, digital volume control and compressor-limiter functions.
Pin Mnemonic
SCLK SDOUT SDIN LRCK MCLKIN MCLKOUT
Pin Mnemonic
SSICLK SSITXDA SSIRXDA SSITXFR SSIRXFR
I/O
I/O O I I/O I/O
Pin Description
Serial bit clock Serial data out Serial data in Transmit frame sync Receive frame sync
I/O
O O I O I O
Pin Description
Serial bit clock Serial data out Serial data in Sample clock Master clock input Master clock output
Table 6. SSI2 Interface Pin Assignments Note: See Table 17 on page 10 for information on pin multiplexes.
Table 4. DAI Interface Pin Assignments Note: See Table 17 on page 10 for information on pin multiplexes.
CODEC Interface
The EP7309 includes an interface to telephony-type CODECs for easy integration into voice-over-IP and other voice
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EP7309 High-Performance, Low-Power System on Chip
Synchronous Serial Interface
* * ADC (SSI) Interface: Master mode only; SPI and Microwire1-compatible (128 kbps operation) Selectable serial clock polarity
* * * * *
Pin Mnemonic
ADCLK ADCIN ADCOUT nADCCS SMPCLK
I/O
O I O O O
Pin Description
SSI1 ADC serial clock SSI1 ADC serial input SSI1 ADC serial output SSI1 ADC chip select SSI1 ADC sample clock
Column outputs can be individually set high with the remaining bits left at high-impedance Column outputs can be driven all-low, all-high, or all-highimpedance Keyboard interrupt driven by OR'ing together all Port A bits Keyboard interrupt can be used to wake up the system 8x8 keyboard matrix usable with no external logic, extra keys can be added with minimal glue logic
Pin Mnemonic
COL[7:0]
I/O
O
Pin Description
Keyboard scanner column drive
Table 7. Serial Interface Pin Assignments
Table 9. Keypad Interface Pin Assignments
LCD Controller
A DMA address generator is provided that fetches video display data for the LCD controller from memory. The display frame buffer start address is programmable, allowing the LCD frame buffer to be in SDRAM, internal SRAM or external SRAM. * * * * * Interfaces directly to a single-scan panel monochrome STN LCD Interfaces to a single-scan panel color STN LCD with minimal external glue logic Panel width size is programmable from 32 to 1024 pixels in 16-pixel increments Video frame buffer size programmable up to 128 KB Bits per pixel of 1, 2, or 4 bits
Interrupt Controller
When unexpected events arise during the execution of a program (i.e., interrupt or memory fault) an exception is usually generated. When these exceptions occur at the same time, a fixed priority system determines the order in which they are handled. The EP7309 interrupt controller has two interrupt types: interrupt request (IRQ) and fast interrupt request (FIQ). The interrupt controller has the ability to control interrupts from 22 different FIQ and IRQ sources. * * * Supports 22 interrupts from a variety of sources (such as UARTs, SSI1, and key matrix.) Routes interrupt sources to the ARM720T's IRQ or FIQ (Fast IRQ) inputs Five dedicated off-chip interrupt lines operate as level sensitive interrupts
.
Pin Mnemonic Pin Mnemonic
CL1 CL2 DD[3:0] FRM M
I/O
I I I (Note) I
Pin Description
External interrupt External interrupt External Fast Interrupt input Media change interrupt input
I/O
O O O O O
Pin Description
nEINT[2:1] LCD line clock LCD pixel clock out LCD serial display data bus LCD frame synchronization pulse LCD AC bias drive Note: Pins are multiplexed. See Table 18 on page 10 for more information. EINT[3] nEXTFIQ nMEDCHG/nBROM
Table 10. Interrupt Controller Pin Assignments
Table 8. LCD Interface Pin Assignments
64-Keypad Interface
Matrix keyboards and keypads can be easily read by the EP7309. A dedicated 8-bit column driver output generates strobes for each keyboard column signal. The pins of Port A, when configured as inputs, can be selectively OR'ed together to provide a keyboard interrupt that is capable of waking the system from a STANDBY or IDLE state.
Real-Time Clock
The EP7309 contains a 32-bit Real Time Clock (RTC) that can be written to and read from in the same manner as the timer counters. It also contains a 32-bit output match register which can be programmed to generate an interrupt. * Driven byan external 32.768 kHz crystal oscillator
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EP7309 High-Performance, Low-Power System on Chip
Pin Mnemonic
RTCIN RTCOUT VDDRTC VSSRTC
Pin Description
Real-Time Clock Oscillator Input Real-Time Clock Oscillator Output Real-Time Clock Oscillator Power Real-Time Clock Oscillator Ground
Pin Mnemonic
PA[7:0] PB[7:0] PD[0]/LEDFLSH PD[5:1] PD[7:6]/SDQM[1:0] (Note) (Note)
I/O
I/O I/O I/O I/O I/O I/O I/O
Pin Description
GPIO port A GPIO port B GPIO port D GPIO port D GPIO port D GPIO port E GPIO port E
Table 11. Real-Time Clock Pin Assignments
PE[1:0]/BOOTSEL[1:0] (Note)
PLL and Clocking
* * Processor and Peripheral Clocks operate from a single 3.6864 MHz crystal or external 13 MHz clock Programmable clock speeds allow the peripheral bus to run at 18 MHz when the processor is set to 18 MHz and at 36 MHz when the processor is set to 36, 49 or 74 MHz
PE[2]/CLKSEL
(Note)
Table 14. General Purpose Input/Output Pin Assignments Note: Pins are multiplexed. See Table 18 on page 10 for more information.
Hardware debug Interface
* Full JTAG boundary scan and Embedded ICE(R) support
Pin Mnemonic
MOSCIN MOSCOUT VDDOSC VSSOSC
Pin Description
Main Oscillator Input Main Oscillator Output Main Oscillator Power Main Oscillator Ground
Pin Mnemonic
TCLK TDI TDO nTRST
I/O
I I O I I
Pin Description
JTAG clock JTAG data input JTAG data output JTAG async reset input JTAG mode select
Table 12. PLL and Clocking Pin Assignments
DC-to-DC converter interface (PWM)
* Provides two 96 kHz clock outputs with programmable duty ratio (from 1-in-16 to 15-in-16) that can be used to drive a positive or negative DC to DC converter
TMS
Table 15. Hardware Debug Interface Pin Assignments
LED Flasher
A dedicated LED flasher module can be used to generate a low frequency signal on Port D pin 0 for the purpose of blinking an LED without CPU intervention. The LED flasher feature is ideal as a visual annunciator in battery powered applications, such as a voice mail indicator on a portable phone or an appointment reminder on a PDA. * * * * Software adjustable flash period and duty cycle Operates from 32 kHz RTC clock Will continue to flash in IDLE and STANDBY states 4 mA drive current
Pin Mnemonic
DRIVE[1:0] FB[1:0]
I/O
I/O I
Pin Description
PWM drive output PWM feedback input
Table 13. DC-to-DC Converter Interface Pin Assignments
Timers
* * Internal (RTC) timer Two internal 16-bit programmable hardware count-down timers
General Purpose Input/Output (GPIO)
* * Three 8-bit and one 3-bit GPIO ports Supports scanning keyboard matrix
Pin Mnemonic
PD[0]/LEDFLSH (Note)
I/O
O
Pin Description
LED flasher driver
Table 16. LED Flasher Pin Assignments Note: Pins are multiplexed. See Table 18 on page 10 for more information.
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EP7309 High-Performance, Low-Power System on Chip
Internal Boot ROM
The internal 128 byte Boot ROM facilitates download of saved code to the on-board SRAM/FLASH.
Pin Mnemonic
SSITXFR SSIRXFR BUZ
I/O
I/O I O
DAI
LRCK MCLKIN MCLKOUT
SSI2
SSITXFR SSIRXFR
CODEC
PCMSYNC p/u
Packaging
The EP7309 is available in a 208-pin LQFP package, 256-ball PBGA package or a 204-ball TFBGA package.
Table 17. DAI/SSI2/CODEC Pin Multiplexing
Pin Multiplexing
The following table shows the pin multiplexing of the DAI, SSI2 and the CODEC. The selection between SSI2 and the CODEC is controlled by the state of the SERSEL bit in SYSCON2. The choice between the SSI2, CODEC, and the DAI is controlled by the DAISEL bit in SYSCON3 (see the EP7309 User's Manual for more information).
Pin Mnemonic
SSICLK SSITXDA SSIRXDA
The following table shows the pins that have been multiplexed in the EP7309.
Signal
RUN nMEDCHG PD[0] PE[1:0] PE[2]
Block
System Configuration Interrupt Controller GPIO GPIO GPIO
Signal
CLKEN nBROM LEDFLSH BOOTSEL[1:0] CLKSEL
Block
System Configuration Boot ROM select LED Flasher System Configuration System Configuration
I/O
I/O O I
DAI
SCLK SDOUT SDIN
SSI2
SSICLK SSITXDA SSIRXDA
CODEC
PCMCLK PCMOUT PCMIN
Table 17. DAI/SSI2/CODEC Pin Multiplexing
Table 18. Pin Multiplexing
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
System Design
As shown in system block diagram, simply adding desired memory and peripherals to the highly integrated EP7309 completes a low-power system solution. All necessary interface logic is integrated on-chip.
CRYSTAL CRYSTAL
MOSCIN RTCIN
DD[0-3] CL1 CL2 FRM M COL[0-7]
LCD
nCS[4] PB0 EXPCLK D[0-31]
PA[0-7] PB[0-7] PD[0-7] PE[0-2] nPOR nPWRFL BATOK nEXTPWR nBATCHG RUN WAKEUP DRIVE[0-1] FB[0-1] SSICLK SSITXFR SSITXDA SSIRXDA SSIRXFR LEDDRV PHDIN
KEYBOARD
EP7309
PC CARD SOCKET
PC CARD CONTROLLER
A[0-27] nMOE WRITE
POWER SUPPLY UNIT AND COMPARATORS
DC INPUT
BATTERY
nCS[0] nCS[1]
DC-TO-DC CONVERTERS CODEC/SSI2/ DAI
x16 FLASH x16 FLASH
x16 FLASH x16 FLASH
IR LED AND PHOTODIODE
CS[n] WORD
EXTERNAL MEMORYMAPPED EXPANSION
BUFFERS
nCS[2] nCS[3]
RXD1/2 TXD1/2 DSR CTS DCD ADCCLK nADCCS ADCOUT ADCIN SMPCLK
2x RS-232 TRANSCEIVERS
ADDITIONAL I/O
BUFFERS AND LATCHES
ADC
DIGITIZER
LEDFLSH
Figure 1. A Maximum EP7309 Based System Note: A system can only use one of the following peripheral interfaces at any given time: SSI2,CODEC or DAI.
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EP7309 High-Performance, Low-Power System on Chip
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
DC Core, PLL, and RTC Supply Voltage DC I/O Supply Voltage (Pad Ring) DC Pad Input Current Storage Temperature, No Power 2.9 V 3.6 V 10 mA/pin; 100 mA cumulative -40C to +125C
Recommended Operating Conditions
DC core, PLL, and RTC Supply Voltage DC I/O Supply Voltage (Pad Ring) DC Input / Output Voltage Operating Temperature 2.5 V 0.2 V 2.3 V - 3.5 V O-I/O supply voltage Extended -20C to +70C; Commercial 0C to +70C; Industrial -40C to +85C
DC Characteristics
All characteristics are specified at VDDCORE = 2.5 V, VDDIO = 3.3 V and VSS = 0 V over an operating temperature of 0C to +70C for all frequencies of operation. The current consumption figures have test conditions specified per parameter."
Symbol
VIH VIL VT+
Parameter
CMOS input high voltage CMOS input low voltage Schmitt trigger positive going threshold Schmitt trigger negative going threshold Schmitt trigger hysteresis CMOS output high voltagea
Min
0.65 x VDDIO VSS - 0.3 -
Typ
-
Max
VDDIO + 0.3 0.25 x VDDIO 2.1
Unit
V V V
Conditions
VDDIO = 2.5 V VDDIO = 2.5 V
VTVhst
0.8 0.1 VDD - 0.2 2.5 2.5 25 8 8
-
0.4 0.3 0.5 0.5 1.0 100 10.0 10.0
V V V V V V V V A A pF pF VIL to VIH IOH = 0.1 mA IOH = 4 mA IOH = 12 mA IOL = -0.1 mA IOL = -4 mA IOL = -12 mA VIN = VDD or GND VOUT = VDD or GND
VOH
Output drive 1a Output drive 2a CMOS output low voltagea
VOL
Output drive 1a Output drive 2a
IIN IOZ CIN COUT
Input leakage current Bidirectional 3-state leakage currentb c Input capacitance Output capacitance
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Symbol
CI/O
Parameter
Transceiver capacitance
Min
8
Typ
-
Max
10.0
Unit
pF
Conditions
IDDSTANDBY
@ 25 C
Standby current consumption1 Core, Osc, RTC @2.5 V I/O @ 3.3 V
-
77 41
-
A
Only nPOR, nPWRFAIL, nURESET, PE0, PE1, and RTS are driven, while all other float, VIH = VDD 0.1 V, VIL = GND 0.1 V Only nPOR, nPWRFAIL, nURESET, PE0, PE1, and RTS are driven, while all other float, VIH = VDD 0.1 V, VIL = GND 0.1 V Only nPOR, nPWRFAIL, nURESET, PE0, PE1, and RTS are driven, while all other float, VIH = VDD 0.1 V, VIL = GND 0.1 V Both oscillators running, CPU static, Cache enabled, LCD disabled, VIH = VDD 0.1 V, VIL = GND 0.1 V Minimum standby voltage for state retention, internal SRAM cache, and RTC operation only
IDDSTANDBY
@ 70 C
Standby current consumption1 Core, Osc, RTC @2.5 V I/O @ 3.3 V
-
-
570 111
A
IDDSTANDBY
@ 85 C
Standby current consumption1 Core, Osc, RTC @2.5 V I/O @ 3.3 V 1693 163 A
IDDidle at 74 MHz
Idle current consumption1 Core, Osc, RTC @2.5 V I/O @ 3.3 V
-
6 10
-
mA
VDDSTANDBY Standby supply voltage a. b. c. Note:
2.0
-
-
V
Refer to the strength column in the pin assignment tables for all package types. Assumes buffer has no pull-up or pull-down resistors. The leakage value given assumes that the pin is configured as an input pin but is not currently being driven. 1) Total power consumption = IDDCORE x 2.5 V + IDDIO x 3.3 V 2) A typical design will provide 3.3 V to the I/O supply (i.e., VDDIO), and 2.5 V to the remaining logic. This is to allow the I/O to be compatible with 3.3 V powered external logic (i.e., 3.3 V SDRAMs). 2) Pull-up current = 50 A typical at VDD = 3.3 V.
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
13
EP7309 High-Performance, Low-Power System on Chip
Timings
Timing Diagram Conventions
This data sheet contains timing diagrams. The following key explains the components used in these diagrams. Any variations are clearly labelled when they occur. Therefore, no additional meaning should be attached unless specifically stated.
C lo c k
H ig h
to
Low
H ig h / L o w
to
H ig h
Bus C hange
Bus
V a lid
U n d e f in e d / I n v a lid
V a lid
B u s to
T r is ta te
B u s / S ig n a l O m is s io n
Figure 2. Legend for Timing Diagrams
Timing Conditions
Unless specified otherwise, the following conditions are true for all timing measurements. All characteristics are specified at VDDIO = 3.1 - 3.5 V and VSS = 0 V over an operating temperature of -40C to +85C. Pin loadings is 50 pF. The timing values are referenced to 1/2 VDD.
14
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
Static Memory
Figure 3 through Figure 6 define the timings associated with all phases of the Static Memory. The following table contains the values for the timings of each of the Static Memory modes.
Parameter
EXPCLK rising edge to nCS assert delay time EXPCLK falling edge to nCS deassert hold time EXPCLK rising edge to A assert delay time EXPCLK falling edge to A deassert hold time EXPCLK rising edge to nMWE assert delay time EXPCLK rising edge to nMWE deassert hold time EXPCLK falling edge to nMOE assert delay time EXPCLK falling edge to nMOE deassert hold time EXPCLK falling edge to HALFWORD deassert delay time EXPCLK falling edge to WORD assert delay time EXPCLK rising edge to data valid delay time EXPCLK falling edge to data invalid delay time Data setup to EXPCLK falling edge time EXPCLK falling edge to data hold time EXPCLK rising edge to WRITE assert delay time EXPREADY setup to EXPCLK falling edge time EXPCLK falling edge to EXPREADY hold time
Symbol
tCSd tCSh tAd tAh tMWd tMWh tMOEd tMOEh tHWd tWDd tDv tDnv tDs tDh tWRd tEXs tEXh
Min
2 2 4 3 3 3 3 2 2 2 8 6 5 -
Typ
8 7 9 10 6 6 7 7 8 8 13 15 11 -
Max
20 20 16 19 10 10 10 10 20 16 21 30 1 3 23 0 0
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
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15
EP7309 High-Performance, Low-Power System on Chip
Static Memory Single Read Cycle
EXPCLK
t C Sd
nCS
t C Sh
t Ad
A
nM W E
t M O Ed
nM OE
t M O Eh
tH W d
HALFW ORD
tW D d
W ORD
tD s
D
tD h
t EXs
EXPRDY
t EXh
tW R d
W R IT E
Figure 3. Static Memory Single Read Cycle Timing Measurement
Note:
1. The cycle time can be extended by integer multiples of the clock period (22 ns at 45 MHz, 27 ns at 36 MHz, 54 ns at 18.432 MHz, and 77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity. 2. Address, Halfword, Word, and Write hold state until next cycle.
16
(c)Copyright Cirrus Logic, Inc. 2005
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Static Memory Single Write Cycle
EXPCLK
t C Sd
nCS
t C Sh
t Ad
A
tM W d
nM W E
tM W h
nM OE
tH W d
HALFW ORD
tW D d
W ORD
tD v
D
t EXs
EXPRDY
t EXh
W R IT E
Figure 4. Static Memory Single Write Cycle Timing Measurement
Note:
1. The cycle time can be extended by integer multiples of the clock period (22 ns at 45 MHz, 27 ns at 36 MHz, 54 ns at 18.432 MHz, and 77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity. 2. Zero wait states for sequential writes is not permitted for memory devices which use nMWE pin, as this cannot be driven with valid timing under zero wait state conditions. 3. Address, Data, Halfword, Word, and Write hold state until next cycle.
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
17
EP7309 High-Performance, Low-Power System on Chip
Static Memory Burst Read Cycle
EXPCLK
t C Sd
nCS
t C Sh
t Ad
A
t Ah
t Ah
t Ah
nM W E
t M O Ed
nM OE
t M O Eh
tH W d
HALF W ORD
W ORD
tW D d tD s tD h tD s tD h tD s tD h tD s tD h
D
t EXs
EXPRDY
t EXh
tW R d
W R IT E
Figure 5. Static Memory Burst Read Cycle Timing Measurement
Note: 1. Four cycles are shown in the above diagram (minimum wait states, 1-0-0-0). This is the maximum number of consecutive cycles that can be driven. The number of consecutive cycles can be programmed from 2 to 4, inclusively. 2. The cycle time can be extended by integer multiples of the clock period (22 ns at 45 MHz, 27 ns at 36 MHz, 54 ns at 18.432 MHz, and 77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity. 3. Consecutive reads with sequential access enabled are identical except that the sequential access wait state field is used to determine the number of wait states, and no idle cycles are inserted between successive non-sequential ROM/expansion cycles. This improves performance so the SQAEN bit should always be set where possible. 4. Address, Halfword, Word, and Write hold state until next cycle.
18
(c)Copyright Cirrus Logic, Inc. 2005
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Static Memory Burst Write Cycle
EXPCLK
t C Sd
nCS
t C Sh
t Ah t Ad
A
t Ah
t Ah
tM W d
nM W E
tM W d tM W h tM W h
tM W d tM W h
tM W d tM W h
nM OE
tH W d
HALF W ORD
W ORD
tW D d tD v t D nv tD v t D nv tD v t D nv tD v
D
t EXs
EXPRDY
t EXh
W R IT E
Figure 6. Static Memory Burst Write Cycle Timing Measurement
Note:
1. Four cycles are shown in the above diagram (minimum wait states, 1-1-1-1). This is the maximum number of consecutive cycles that can be driven. The number of consecutive cycles can be programmed from 2 to 4, inclusively. 2. The cycle time can be extended by integer multiples of the clock period (22 ns at 45 MHz, 27 ns at 36 MHz, 54 ns at 18.432 MHz, and 77 ns at 13 MHz), by either driving EXPRDY low and/or by programming a number of wait states. EXPRDY is sampled on the falling edge of EXPCLK before the data transfer. If low at this point, the transfer is delayed by one clock period where EXPRDY is sampled again. EXPCLK need not be referenced when driving EXPRDY, but is shown for clarity. 3. Zero wait states for sequential writes is not permitted for memory devices which use nMWE pin, as this cannot be driven with valid timing under zero wait state conditions. 4. Address, Data, Halfword, Word, and Write hold state until next cycle.
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
19
EP7309 High-Performance, Low-Power System on Chip
SSI1 Interface
Parameter
ADCCLK falling edge to nADCCSS deassert delay time ADCIN data setup to ADCCLK rising edge time ADCIN data hold from ADCCLK rising edge time ADCCLK falling edge to data valid delay time ADCCLK falling edge to data invalid delay time
Symbol
tCd tINs tINh tOvd tOd
Min
9 -7 -2
Max
10 15 14 13 3
Unit
ms ns ns ns ns
ADC CLK
tCd
nADC CSS
tINs
tINh
ADCIN
tOvd tOd
ADC OUT
Figure 7. SSI1 Interface Timing Measurement
20
(c)Copyright Cirrus Logic, Inc. 2005
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
SSI2 Interface
Parameter
SSICLK period (slave mode) SSICLK high time SSICLK low time SSICLK rise/fall time SSICLK rising edge to RX and/or TX frame sync high time SSICLK rising edge to RX and/or TX frame sync low time SSIRXFR and/or SSITXFR period SSIRXDA setup to SSICLK falling edge time SSIRXDA hold from SSICLK falling edge time SSICLK rising edge to SSITXDA data valid delay time SSITXDA valid time
Symbol
tclk_per tclk_high tclk_low tclkrf tFRd tFRa tFR_per tRXs tRXh tTXd tTXv
Min
185 925 925 3 960 3 3 960
Max
2050 1025 1025 18 3 8 990 7 7 2 990
Unit
ns ns ns ns ns ns ns ns ns ns ns
t clk_per
t clk_high
t clk_low
SSI CLK
t clkrf t FR d t FR _per t FR a
S S IR X F R / S S IT X F R
t R Xh t R Xs
SSI RXDA
t TXd
D7
D2
D1
D0
SSI TXDA
D7
t TXv
D2
D1
D0
Figure 8. SSI2 Interface Timing Measurement
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
21
EP7309 High-Performance, Low-Power System on Chip
LCD Interface
Parameter
CL[2] falling to CL[1] rising delay time CL[1] falling to CL[2] rising delay time CL[1] falling to FRM transition time CL[1] falling to M transition time CL[2] rising to DD (display data) transition time
Symbol
tCL1d tCL2d tFRMd tMd tDDd
Min
- 10 80 300 - 10 - 10
Max
25 3,475 10,425 20 20
Unit
ns ns ns ns ns
C L [2 ]
t C L1d
C L [1 ]
t C L2d
t FR M d
FRM
tM d
M
tD D d
D D [3 :0 ]
Figure 9. LCD Controller Timing Measurement
22
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
JTAG Interface
Parameter
TCK clock period TCK clock high time TCK clock low time JTAG port setup time JTAG port hold time JTAG port clock to output JTAG port high impedance to valid output JTAG port valid output to high impedance
Symbol
tclk_per tclk_high tclk_low tJPs tJPh tJPco tJPzx tJPxz
Min
2 1 1 -
Max
0 3 10 12 19
Units
ns ns ns ns ns ns ns ns
t clk_per t clk_high
TCK
t clk_low
t JPh t JPs
TM S
TDI
t JPzx
TDO
t JPco
t JPxz
Figure 10. JTAG Timing Measurement
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
23
EP7309 High-Performance, Low-Power System on Chip
Packages
208-Pin LQFP Package Characteristics
208-Pin LQFP Package Specifications
29.60 (1.165) 30.40 (1.197) 27.80 (1.094) 28.20 (1.110) 0.17 (0.007) 0.27 (0.011)
27.80 (1.094) 28.20 (1.110)
29.60 (1.165) 30.40 (1.197)
EP7309
208-Pin LQFP
0.50 (0.0197) BSC
Pin 1 Indicator
Pin 208 Pin 1
0.45 (0.018) 0.75 (0.030)
1.35 (0.053) 1.45 (0.057)
1.00 (0.039) BSC
0.09 (0.004) 0.20 (0.008) 1.40 (0.055) 1.60 (0.063) 0.05 (0.002) 0.15 (0.006)
0 MIN 7 MAX
Figure 11. 208-Pin LQFP Package Outline Drawing Note: 1) Dimensions are in millimeters (inches), and controlling dimension is millimeter. 2) Drawing above does not reflect exact package pin count. 3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information. 4) For pin locations, please see Figure 12. For pin descriptions see the EP7309 User's Manual.
24
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
208-Pin LQFP Pin Diagram
nURESET nMEDCHG/nBROM nPOR BATOK nEXTPWR nBATCHG D[7] VSSIO A[7] D[8] A[8] D[9] A[9] D[10] A[10] D[11] VSSIO VDDIO A[11] D[12] A[12] D[13] A[13] D[14] A[14] D[15] A[15] D[16] A[16] D[17] A[17] nTRST VSSIO VDDIO D[18] A[18 D[19] A[19] D[20] A[20] VSSIO D[21] A[21] D[22] A[22] D[23] A[23] D[24] VSSIO VDDIO A[24] HALFWORD 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105
VDDOSC MOSCIN MOSCOUT VSSOSC WAKEUP nPWRFL A[6] D[6] A[5] D[5] VDDIO VSSIO A[4] D[4] A[3] D[3] A[2] VSSIO D[2] A[1] D[1] A[0] D[0] VSSCORE VDDCORE VSSIO VDDIO CL[2] CL[1] FRM M DD[3] DD[2] VSSIO DD[1] DD[0]
VDDIO VSSIO
N/C N/C N/C N/C
Note:
1. N/C should not be grounded but left as no connects. 2. Pin differences between the EP7212 and the EP7309 are bolded.
DS507F1
nCS[5] VDDIO VSSIO EXPCLK WORD WRITE RUN/CLKEN EXPRDY TXD[2] RXD[2] TDI VSSIO PB[7] PB[6] PB[5] PB[4] PB[3] PB[2] PB[1] PB[0] VDDIO TDO PA[7] PA[6] PA[5] PA[4] PA[3] PA[2] PA[1] PA[0] LEDDRV TXD[1] VSSIO PHDIN CTS RXD[1] DCD DSR nTEST[1] nTEST[0] EINT[3] nEINT[2] nEINT[1] nEXTFIQ PE[2]/CLKSEL PE[1]BOOTSEL[1] PE[0]BOOTSEL[0] VSSRTC RTCOUT RTCIN VDDRTC N/C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52
nMWE nMOE VSSIO nCS[0] nCS[1] nCS[2] nCS[3] nCS[4]
N/C N/C
157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208
EP7309
208-Pin LQFP
(Top View)
104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53
D[25] A[25] D[26] A[26] D[27] A[27] VSSIO D[28] D[29] D[30] D[31] BUZ COL[0] COL[1] TCLK VDDIO COL[2] COL[3] COL[4] COL[5] COL[6] COL[7] FB[0] VSSIO FB[1] SMPCLK ADCOUT ADCCLK DRIVE[0] DRIVE[1] VDDIO VSSIO VDDCORE VSSCORE nADCCS ADCIN SSIRXFR SSIRXDA SSITXDA SSITXFR VSSIO SSICLK PD[0]/LEDFLSH PD[1] PD[2] PD[3] TMS VDDIO PD[4] PD[5] PD[6] PD[7]
Figure 12. 208-Pin LQFP (Low Profile Quad Flat Pack) Pin Diagram
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
25
EP7309 High-Performance, Low-Power System on Chip
208-Pin LQFP Numeric Pin Listing
Table 19. 208-Pin LQFP Numeric Pin Listing Table 19. 208-Pin LQFP Numeric Pin Listing (Continued)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
Signal
nCS[5] VDDIO VSSIO EXPCLK WORD WRITE RUN/CLKEN EXPRDY TXD[2] RXD[2] TDI VSSIO PB[7] PB[6] PB[5] PB[4] PB[3] PB[2] PB[1]/PRDY2 PB[0]/PRDY1 VDDIO TDO PA[7] PA[6] PA[5] PA[4] PA[3] PA[2] PA[1] PA[0] LEDDRV TXD[1] VSSIO PHDIN CTS RXD[1]
Type
O Pad Pwr Pad Gnd I/O Out Out O I O I I Pad Gnd I/O I/O I/O I/O I/O I/O I/O I/O Pad Pwr O I/O I/O I/O I/O I/O I/O I/O I/O O O Pad Gnd I I I
Strength
1
Reset State
High
Pin No.
37 38 39
Signal
DCD DSR nTEST[1] nTEST[0] EINT[3] nEINT[2] nEINT[1] nEXTFIQ PE[2]/CLKSEL PE[1]/ BOOTSEL[1] PE[0]/ BOOTSEL[0] VSSRTC RTCOUT RTCIN VDDRTC N/C PD[7] PD[6] PD[5] PD[4] VDDIO TMS PD[3] PD[2] PD[1] PD[0]/LEDFLSH SSICLK VSSIO SSITXFR SSITXDA SSIRXDA SSIRXFR ADCIN nADCCS VSSCORE VDDCORE
Type
I I I I I I I I I/O I/O I/O RTC Gnd O I RTC power
Strength
Reset State
With p/u* With p/u*
1 1 1 1 1 1 High Low Low Low
40 41 42 43 44 45 46
1 1 1
Input Input Input
with p/u* 47 1 1 1 1 1 1 1 1 Input Input Input Input Input Input Input Input 48 49 50 51 52 53 54 55 56 1 1 1 1 1 1 1 1 1 1 1 1 Three state Input Input Input Input Input Input Input Input Low High High 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
I/O I/O I/O I/O Pad Pwr I I/O I/O I/O I/O I/O Pad Gnd I/O O I I/O I O Core Gnd Core Pwr
1 1 1 1
Low Low Low Low
with p/u* 1 1 1 1 1 Low Low Low Low Input
1 1
Low Low
Input
1
High
26
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 19. 208-Pin LQFP Numeric Pin Listing (Continued) Table 19. 208-Pin LQFP Numeric Pin Listing (Continued)
Pin No.
73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109
Signal
VSSIO VDDIO DRIVE[1] DRIVE[0] ADCCLK ADCOUT SMPCLK FB[1] VSSIO FB[0] COL[7] COL[6] COL[5] COL[4] COL[3] COL[2] VDDIO TCLK COL[1] COL[0] BUZ D[31] D[30] D[29] D[28] VSSIO A[27] D[27] A[26] D[26] A[25] D[25] HALFWORD A[24] VDDIO VSSIO D[24]
Type
Pad Gnd Pad Pwr I/O I/O O O O I Pad Gnd I O O O O O O Pad Pwr I O O O I/O I/O I/O I/O Pad Gnd O I/O O I/O O I/O O O Pad Pwr Pad Gnd I/O
Strength
Reset State
Pin No.
110 111
Signal
A[23] D[23] A[22] D[22] A[21] D[21] VSSIO A[20] D[20] A[19] D[19] A[18] D[18] VDDIO VSSIO nTRST A[17] D[17] A[16] D[16] A[15] D[15] A[14] D[14] A[13] D[13] A[12] D[12] A[11] VDDIO VSSIO D[11] A[10] D[10] A[9] D[9] A[8] D[8]
Type
O I/O O I/O O I/O Pad Gnd O I/O O I/O O I/O Pad Pwr Pad Gnd I O I/O O I/O O I/O O I/O O I/O O I/O O Pad Pwr Pad Gnd I/O O I/O O I/O O I/O
Strength
1 1 1 1 1 1
Reset State
Low Low Low Low Low Low
2 2 1 1 1
High / Low High / Low Low Low Low
112 113 114 115 116 117 118 119 120
1 1 1 1 1 1
Low Low Low Low Low Low
1 1 1 1 1 1
High High High High High High
121 122 123 124 125 126 127 128
1 1 1 1 1 1 1 1 1 1 1 1 1
Low Low Low Low Low Low Low Low Low Low Low Low Low
1 1 1 1 1 1 1
High High Low Low Low Low Low
129 130 131 132 133 134 135 136
2 1 2 1 2 1 1 1
Low Low Low Low Low Low Low Low -- --
137 138 139 140 141 142 143 144 145 146 147
1 1 1 1 1 1 1
Low Low Low Low Low Low Low
1
Low
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
27
EP7309 High-Performance, Low-Power System on Chip
Table 19. 208-Pin LQFP Numeric Pin Listing (Continued) Table 19. 208-Pin LQFP Numeric Pin Listing (Continued)
Pin No.
148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185
Signal
A[7] VSSIO D[7] nBATCHG nEXTPWR BATOK nPOR nMEDCHG/ nBROM nURESET VDDOSC MOSCIN MOSCOUT VSSOSC WAKEUP nPWRFL A[6] D[6] A[5] D[5] VDDIO VSSIO A[4] D[4] A[3] D[3] A[2] VSSIO D[2] A[1] D[1] A[0] D[0] VSS CORE VDD CORE VSSIO VDDIO CL[2] CL[1]
Type
O Pad Gnd I/O I I I I I I Osc Pwr Osc Osc Osc Gnd I I O I/O Out I/O Pad Pwr Pad Gnd O I/O O I/O O Pad Gnd I/O O I/O O I/O Core Gnd Core Pwr Pad Gnd Pad Pwr O O
Strength
1
Reset State
Low
Pin No.
186 187
Signal
FRM M DD[3] DD[2] VSSIO DD[1] DD[0] N/C N/C N/C N/C VDDIO VSSIO N/C N/C nMWE nMOE VSSIO nCS[0] nCS[1] nCS[2] nCS[3] nCS[4]
Type
O O I/O I/O Pad Gnd I/O I/O O O I/O I/O Pad Pwr Pad Gnd I/O I/O O O Pad Gnd O O O O O
Strength
1 1 1 1
Reset State
Low Low Low Low
1
Low
188 189 190 191
1 1 1 1 2 2
Low Low High High Low Low
Schmitt
192 193 194
Schmitt
195 196 197 198 199
2 2 1 1
Low Low High High
Schmitt
200 201 Low Low Low Low
1 1 1 1
202 203 204 205 206 207
1 1 1 1 1
High High High High High
1 1 2 1 2
Low Low Low Low Low
208
*With p/u' means with internal pull-up on the pin.
1 2 1 2 1
Low Low Low Low Low
1 1
Low Low
28
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
TOP VIEW A1 CORNER
12 A B C D E 0.65 F G H 130.05 J K L M N P R T U V W Y A 12.35 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
O0.08 M C O0.15 M C A B O0.25~0.35(204X)
BOTTOM VIEW A1 CORNER
8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V W Y
20 19 18 17 16 15 14 13 12 11 10 9
0.65 12.35 B 130.05
0.530.05
0.20 C
0.15(4X) C
0.10 C
Ball Pitch : 0.65
0.36 0.20~0.30 C
SEATING PLANE
Ball Diam eter :
1.20 M AX.
0.3
Substrate Thickness : 0.36 Mold Thickness : 0.53
Figure 13. 204-Ball TFBGA Package
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
29
EP7309 High-Performance, Low-Power System on Chip
204-Ball TFBGA Pinout (Top View)
1 A VDDR 2 EXPCLK 3 nCS3 4 5 6 N/C 7 N/C 8 DD2 9 FRM 10 CL1 11 GNDD 12 D1 13 A2 14 D4 15 A5 16 17 18 GNDR 19 GNDR 20 GNDR A
nCS1 nMWE
nPWRFL MOSCOUT
B WORD
VDDR
nCS5
nCS2
nMOE
N/C
N/C
DD1
M
CL2
D0
A1
D3
A4
D6
WAKEUP MOSCIN
GNDR
GNDR nURESET B
C
RUN/ EXPRDY VDDR CLKEN PB7 RXD2 VDDR
nCS4
nCS0
N/C
N/C
DD0
DD3
VDDD
A0
D2
A3
D5
A6
GNDO
VDDO
GNDR
BATOK
nPOR
C
D
GNDR
nBATCHG
A7
D
E
PB4
TXD2
WRITE
nMEDCHG nEXTPWR /nBROM D7 A8
D9
E
F
PB3
PB6
TDI
D10
F
G
PB1
PB2
PB5
D8
A9
D11
G
H
PA7
TDO
PB0
A10
D12
A12
H
J
PA4
PA5
PA6
A11
D13
A13
J
K
PA1
PA2
VDDR
D14
A14
D15
K
L
TXD1
LEDDRV
PA3
VDDR
D16
A16
L
M RXD1
CTS
PA0
A15
A17
nTRST M
N
DSR
nTEST1 PHDIN
D17
D19
A18
N
P EINT3
nEINT2
DCD
D18
A20
D20
P
R nEXTFIQ PE1/ BOOT SEL1
PE2/ nTEST0 CLKSEL PE0/ BOOT SEL0
A19
D22
A21
R
T
nEINT1
D21
D23
A22
T
U GNDC
RTCOUT RTCIN
HALF WORD PD7 PD4 PD2 SSICLK SSIRXDA nADCCS VDDR ADCCLK COL7 COL4 TCLK BUZ D29 A26 VDDR
D24
A23
U
V VDDC
GNDR
GNDR
VDDR
A24
V
W GNDR
GNDR
GNDR
PD6
TMS
PD1
SSITXFR SSIRXFR GNDD1 DRIVE1 ADCOUT
FB0
COL5 COL2
COL0
D30
A27
D26
VDDR
D25
W
Y GNDR
GNDR
GNDR
PD5
PD3
PD0/ LED SSITXDA ADCIN FLSH
VDD1 DRIVE0 SMPLCK
FB1
COL6 COL3
COL1
D31
D28
D27
A25
VDDR
Y
30
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
204-Ball TFBGA Ball Listing
The list is ordered by ball location.
Table 20. 204-Ball TFBGA Ball Listing
Ball Location Name
Strength
Reset State
Type
Description
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14
VDDIO EXPCLK nCS[3] nCS[1] nMWE/nSDWE N/C N/C DD[2] FRM CL[1] VSSCORE D[1] A[2] D[4] A[5] nPWRFL MOSCOUT VSSIO VSSIO VSSIO WORD VDDIO nCS[5] nCS[2] nMOE/nSDCAS N/C N/C DD[1] M CL[2] D[0] A[1] D[3] A[4] 1 1 1 1 2 2 1 Low Low Low Low Low Low Low 1 1 1 Low High High 1 Low 1 2 1 1 Low Low Low Low 1 1 1 Low Low Low 1 1 1 1 High High High
Pad power I O O O
Digital I/O power, 3.3 V Expansion clock input Chip select 3 Chip select 1 ROM, expansion write enable/ SDRAM write enable control signal
O O O Core ground I/O O I/O O I O Pad ground Pad ground Pad ground O Pad power O O O
LCD serial display data LCD frame synchronization pulse LCD line clock Core ground Data I/O System byte address Data I/O System byte address Power fail sense input Main oscillator out I/O ground I/O ground I/O ground Word access select output Digital I/O power, 3.3 V Chip select 5 Chip select 2 ROM, expansion OP enable/SDRAM CAS control signal
O O 0 I/O O I/O O
LCD serial display data LCD AC bias drive LCD pixel clock out Data I/O System byte address Data I/O System byte address
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
31
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength 1 Schmitt
Reset State Low
Type
Description
B15 B16 B17 B18 B19 B20 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19
D[6] WAKEUP MOSCIN VSSIO VSSIO nURESET RUN/CLKEN EXPRDY VDDIO nCS[4] nCS[0] N/C N/C DD[0] DD[3] VDDCORE A[0] D[2] A[3] D[5] A[6] VSSOSC VDDOSC VSSIO BATOK
I/O I I Pad ground Pad ground
Data I/O System wake up input Main oscillator input I/O ground I/O ground User reset input Run output / clock enable output Expansion port ready input Digital I/O power, 3.3 V Chip select 4 Chip select 0
Schmitt 1 1 Low
I 0 I Pad power
1 1
High High
O O
1 1
Low Low
O O Core power
LCD serial display data LCD serial display data Digital core power, 2.5 V System byte address Data I/O System byte address Data I/O System byte address PLL ground Oscillator power in, 2.5V I/O ground Battery ok input
2 1 2 1 1
Low Low Low Low Low
O I/O O I/O O Oscillator ground Oscillator power Pad ground I
32
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength Schmitt 1
Reset State
Type
Description
C20 D1 D2 D3 D18 D19 D20 E1 E2 E3 E18 E19 E20 F1
nPOR PB[7] RXD[2] VDDIO VSSIO nBATCHG A[7] PB[4] TXD[2] WRITE/nSDRAS nMEDCHG/nBROM nEXTPWR D[9] PB[3]
I
Power-on reset input GPIO port B UART 2 receive data input Digital I/O power, 3.3V I/O ground Battery changed sense input System byte address GPIO port B UART 2 transmit data output Transfer direction / SDRAM RAS signal output Media change interrupt input / internal ROM boot enable External power supply sense input Data I/O GPIO port B GPIO port B
Input
I I Pad power Pad ground I
1 1 1 1
Low
O I O O I I
Input
High Low
1 1
Low
I/O I/O
Input

F2 F3 F18 F19 F20 G1
PB[6] TDI D[7] A[8] D[10] PB[1]
1 with p/u* 1 1 1 1
Input
I/O I
JTAG data input Data I/O System byte address Data I/O
Low Low Low
I/O O I/O I/O
Input

G2
PB[2]
1
Input
I/O
GPIO port B
G3
PB[5]
1
Input
I/O
GPIO port B
G18 G19 G20 H1
D[8] A[9] D[11] PA[7]
1 1 1 1
Input
I/O O I/O I/O
Data I/O System byte address Data I/O GPIO port A
Low Low
Input

H[2]
TDO
1
Input
O
JTAG data out
H[3] H[18] H19 H20 J1
PB[0] A[10] D[12] A[12] PA[4]
1 1 1 1 1
Input
I/O O I/O O I/O
GPIO port B System byte address Data I/O System byte address GPIO port A
Low Low Low
Input
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
33
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength
Reset State
Type
Description
J2
PA[5]
1
Input

I/O
GPIO port A
J3 J18 J19 J20 K1
PA[6] A[11] D[13] A[13]/DRA[14] PA[1]
1 1 1 1 1
Input
I/O O I/O O I/O
GPIO port A System byte address Data I/O System byte address / SDRAM address GPIO port A
Low Low Low
Input

K2 K3 K18 K19 K20 L1 L2 L3 L18 L19 L20 M1 M2 M3 M18 M19 M20 N1 N2 N3 N18 N19 N20 P1 P2 P3 P18 P19
PA[2] VDDIO D[14] A[14]/DRA[13] D[15] TXD[1] LEDDRV PA[3] VDDIO D[16] A[16]/DRA[11] RXD[1] CTS PA[0] A[15]/DRA[12] A[17]/DRA[10] nTRST DSR nTEST[1] PHDIN D[17] D[19] A[18]/DRA[9] EINT[3] nEINT[2] DCD D[18] A[20]/DRA[7]
1
Input
I/O Pad power
GPIO port A Digital I/O power, 3.3V Data I/O System byte address / SDRAM address Data I/O UART 1 transmit data out IR LED drive GPIO port A Digital I/O power, 3.3V Data I/O System byte address / SDRAM address UART 1 receive data input UART 1 clear to send input GPIO port A System byte address / SDRAM address System byte address / SDRAM address JTAG async reset input UART 1 data set ready input Test mode select input Photodiode input Data I/O Data I/O System byte address / SDRAM address External interrupt External interrupt input UART 1 data carrier detect Data I/O System byte address / SDRAM address
1 1 1 1 1 1
Low Low Low High Low
I/O O I/O O O I/O Pad power
Input
1 1
Low Low
I/O O I I
1 1 1
Input
I/O O O I I
Low Low
With p/u*
I I
1 1 1
Low Low Low
I/O I/O O I I I
1 1
Low Low
I/O O
34
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength 1
Reset State Low
Type
Description
P20 R1 R2 R3 R18 R19 R20 T1
D[20] nEXTFIQ PE[2]/CLKSEL nTEST[0] A[19]/DRA[8] D[22] A[21]/DRA[6] PE[1]/BOOTSEL[1]
I/O I
Data I/O External fast interrupt input GPIO port E / clock input mode select Test mode select input System byte address / SDRAM address Data I/O System byte address / SDRAM address GPIO port E / boot mode select
1 With p/u* 1 1 1 1
Input
I/O I
Low Low Low
O I/O O I/O
Input

T2 T3 T18 T19 T20 U1 U2 U3 U18 U19 U20 V1 V2 V3 V4 V5 V6 V7 V8 V9 V10 V11 V12 V13 V14 V15 V16
PE[0]/BOOTSEL[0] nEINT[1] D[21] D[23] A[22]/DRA[5] VSSRTC RTCOUT RTCIN HALFWORD D[24] A[23]/DRA[4] VDDRTC VSSIO VSSIO PD[7]/SDQM[1] PD[4] PD[2] SSICLK SSIRXDA nADCCS VDDIO ADCCLK COL[7] COL[4] TCLK BUZ D[29]
1
Input
I/O I
GPIO port E / boot mode select External interrupt input Data I/O Data I/O System byte address / SDRAM address Real time clock ground Real time clock oscillator output Real time clock oscillator input Halfword access select output Data I/O System byte address / SDRAM address Real time clock power, 2.5V I/O ground I/O ground GPIO port D / SDRAM byte lane mask GPIO port D GPIO port D DAI/CODEC/SSI2 serial clock DAI/CODEC/SSI2 serial data input SSI1 ADC chip select Digital I/O power, 3.3V SSI1 ADC serial clock Keyboard scanner column drive Keyboard scanner column drive JTAG clock Buzzer drive output Data I/O
1 1 1
Low Low Low
I/O I/O O RTC ground O I/O
1 1 1
Low Low Low
O I/O O RTC power Pad ground Pad ground
1 1 1 1
Low Low Low
I/O I/O I/O I/O I/O
Input
1
High
O Pad power
1 1 1
Low High High
O O O I
1 1
Low Low
O I/O
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
35
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength 2
Reset State Low
Type
Description
V17 V18
A[26]/DRA[1] VDDIO
O Pad power
System byte address / SDRAM address Digital I/O power, 3.3 V Digital I/O power, 3.3 V System byte address / SDRAM address I/O ground I/O ground I/O ground GPIO port D / SDRAM byte lane mask JTAG mode select GPIO port D DAI/CODEC/SSI2 frame sync DAI/CODEC/SSI2 frame sync Core Ground PWM drive output SSI1 ADC serial data output PWM feedback input Keyboard scanner column drive Keyboard scanner column drive Keyboard scanner column drive Data I/O System byte address / SDRAM address Data I/O Digital I/O power, 3.3V Data I/O I/O ground I/O ground I/O ground GPIO port D GPIO port D GPIO port D / LED blinker output DAI/CODEC/SSI2 serial data output SSI1 ADC serial input Digital core power, 2.5V PWM drive output
V19 V20 W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10
VDDIO A[24]/DRA[3] VSSIO VSSIO VSSIO PD[6]/SDQM[0] TMS PD[1] SSITXFR SSIRXFR VSSCORE DRIVE[1] ADCOUT FB[0] COL[5] COL[2] COL[0] D[30] A[27]/DRA[0] D[26] VDDIO D[25] VSSIO VSSIO VSSIO PD[5] PD[3] PD[0]/LEDFLSH SSITXDA ADCIN VDDCORE DRIVE[0] 2 1 1 1 1 Low Low Low Low 1 Low 1 1 1 1 2 1 High High High Low Low Low 2 1 High / Low Low 1 with p/u* 1 1 1 Low Low Low ` Low
Pad power O Pad ground Pad ground Pad ground I/O I I/O I/O I/O Core Ground I/O O I O O O I/O O I/O Pad power I/O Pad ground Pad ground Pad ground I/O I/O I/O O I Core power
Input
Input
I/O
36
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 20. 204-Ball TFBGA Ball Listing (Continued)
Ball Location Name
Strength 1
Reset State Low
Type
Description
Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 Y19 Y20
SMPCLK FB[1] COL[6] COL[3] COL[1] D[31] D[28] D[27] A[25]/DRA[2] VDDIO
O I
SSI1 ADC sample clock PWM feedback input Keyboard scanner column drive Keyboard scanner column drive Keyboard scanner column drive Data I/O Data I/O Data I/O System byte address / SDRAM address Digital I/O power, 3.3V
1 1 1 1 1 1 2
High High High Low Low Low Low
O O O I/O I/O I/O O Pad power
*"With p/u" means with internal pull-up of 100 KOhms on the pin.
Strength 1 = 4 ma Strength 2 = 12 ma
Input. Port A,B,D,E GPIOs default to input at nPOR and URESET conditions.
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
37
EP7309 High-Performance, Low-Power System on Chip
256-Ball PBGA Package Characteristics
256-Ball PBGA Package Specifications
0.85 (0.034) 0.05 (.002) 17.00 (0.669) 0.20 (.008) Pin 1 Corner 15.00 (0.590) 0.20 (.008) 30 TYP 0.40 (0.016) 0.05 (.002)
D1
17.00 (0.669) 0.20 (.008)
Pin 1 Indicator
E1
15.00 (0.590) 0.20 (.008)
2 Layer 0.36 (0.014) 0.09 (0.004)
TOP VIEW
SIDE VIEW
D
17.00 (0.669) 1.00 (0.040) REF 1.00 (0.040) Pin 1 Corner
E
16 15 14 13 12 11 10 9 8 7 65 432 1
1.00 (0.040) REF
1.00 (0.040)
A B C D E F G H J K L M N P R T
BOTTOM VIEW
17.00 (0.669)
0.50 R 3 Places
JEDEC #: MO-151 Ball Diameter: 0.50 mm 0.10 mm 17 17 1.61 mm body Figure 14. 256-Ball PBGA Package
Note:
1) For pin locations see Table 21. 2) Dimensions are in millimeters (inches), and controlling dimension is millimeter 3) Before beginning any new EP7309 design, contact Cirrus Logic for the latest package information.
38
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
DS507F1
EP7309 High-Performance, Low-Power System on Chip
256-Ball PBGA Pinout (Top View))
1 A VDDIO 2 nCS[4] 3 nCS[1] 4 N/C 5 N/C 6 DD[1] 7 M 8 VDDIO 9 D[0] 10 D[2] 11 A[3] 12 VDDIO 13 A[6] 14 15 16 VSSIO A
MOSCOUT VDDOSC
B
nCS[5]
VDDIO
nCS[3]
nMOE
VDDIO
N/C
DD[2]
CL[1]
VDDCORE
D[1]
A[2]
A[4]
A[5]
WAKEUP
VDDIO
nURESET B
C
VDDIO
EXPCLK
VSSIO
VDDIO
VSSIO
VSSIO
VSSIO
VDDIO
VSSIO
VSSIO
VSSIO
VDDIO
VSSIO
VSSIO
nPOR
nEXTPWR C
D
WRITE
EXPRDY
VSSIO
VDDIO
nCS[2]
nMWE
N/C
CL[2]
VSSRTC
D[4]
nPWRFL
MOSCIN
VDDIO nMEDCHG/ nBROM nBATCHG
VSSIO
D[7]
D[8]
D
E
RXD[2]
PB[7]
TDI
WORD
VSSIO RUN/ CLKEN PB[6]
nCS[0]
N/C
FRM
A[0]
D[5]
VSSOSC
VSSIO
VDDIO
D[9]
D[10]
E
F
PB[5]
PB[3]
VSSIO
TXD[2]
VSSIO
N/C
DD[3]
A[1]
D[6]
VSSRTC
BATOK
VSSIO
D[11]
VDDIO
F
G
PB[1]
VDDIO
TDO
PB[4]
VSSRTC
VSSRTC
DD[0]
D[3]
VSSRTC
A[7]
A[8]
A[9]
VSSIO
D[12]
D[13]
G
H
PA[7]
PA[5]
VSSIO
PA[4]
PA[6]
PB[0]
PB[2]
VSSRTC
VSSRTC
A[10]
A[11]
A[12]
A[13]
VSSIO
D[14]
D[15]
H
J
PA[3]
PA[1]
VSSIO
PA[2]
PA[0]
TXD[1]
CTS
VSSRTC
VSSRTC
A[17]
A[16]
A[15]
A[14]
nTRST
D[16]
D[17]
J
K LEDDRV
PHDIN
VSSIO
DCD
nTEST[1] PE[2]/ CLKSEL TMS
EINT[3]
VSSRTC
ADCIN
COL[4]
TCLK
D[20]
D[19]
D[18]
VSSIO
VDDIO
VDDIO
K
L
RXD[1]
DSR
VDDIO
nEINT[1] PE[0]/ BOOTSEL[0] VDDIO
VSSRTC
PD[0]/ VSSRTC LEDFLSH SSITXFR DRIVE[1]
COL[6]
D[31]
VSSRTC
A[22]
A[21]
VSSIO
A[18]
A[19]
L
M nTEST[0]
nEINT[2]
VDDIO
VDDIO
FB[0]
COL[0]
D[27]
VSSIO
A[23]
VDDIO
A[20]
D[21]
M
N nEXTFIQ
PE[1]/ VSSIO BOOTSEL[1] RTCOUT VSSIO
PD[5]
PD[2]
SSIRXDA
ADCCLK
SMPCLK
COL[2]
D[29]
D[26]
HALFWORD
VSSIO
D[22]
D[23]
N
P VSSRTC
VSSIO
VDDIO
VSSIO
VSSIO
VDDIO
VSSIO
VDDIO
VSSIO
VSSIO
VDDIO
VSSIO
D[24]
VDDIO
P
R
RTCIN
VDDIO
PD[4]
PD[1]
SSITXDA
nADCCS
VDDIO
ADCOUT
COL[7]
COL[3]
COL[1]
D[30]
A[27]
A[25]
VDDIO
A[24]
R
T VDDRTC
PD[7]
PD[6]
PD[3]
SSICLK
SSIRXFR VDDCORE DRIVE[0]
FB[1]
COL[5]
VDDIO
BUZ
D[28]
A[26]
D[25]
VSSIO
T
256-Ball PBGA Ball Listing
The list is ordered by ball location.
Table 21. 256-Ball PBGA Ball Listing
Ball Location A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 Name VDDIO nCS[4] nCS[1] N/C N/C DD[1] M VDDIO D[0] D[2] A[3] Type Pad power O O O O O O Pad power I/O I/O O LCD serial display data LCD AC bias drive Digital I/O power, 3.3V Data I/O Data I/O System byte address Description A12 Digital I/O power, 3.3V A13 Chip select out A14 Chip select out A15 A16 B1 B2 B3 B4 B5 B6 VDDOSC VSSIO nCS[5] VDDIO nCS[3] nMOE VDDIO N/C Oscillator power Oscillator power in, 2.5V MOSCOUT O Main oscillator out A[6] O System byte address VDDIO Pad power Digital I/O power, 3.3V
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location Name Type Description
Pad ground I/O ground O Pad power O O Pad power O Chip select out I/O ground Chip select out ROM, expansion OP enable Digital I/O power, 3.3V
DS507F1
(c)Copyright Cirrus Logic, Inc. 2005
(All Rights Reserved)
39
EP7309 High-Performance, Low-Power System on Chip
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 E1 E2 E3 E4 E5 E6 Name DD[2] CL[1] VDDCORE D[1] A[2] A[4] A[5] WAKEUP VDDIO nURESET VDDIO EXPCLK VSSIO VDDIO VSSIO VSSIO VSSIO VDDIO VSSIO VSSIO VSSIO VDDIO VSSIO VSSIO nPOR nEXTPWR WRITE EXPRDY VSSIO VDDIO nCS[2] nMWE N/C CL[2] VSSRTC D[4] nPWRFL MOSCIN VDDIO VSSIO D[7] D[8] RXD[2] PB[7] TDI WORD VSSIO nCS[0] Type O O Description LCD serial display data LCD line clock
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location E7 E8 E9 E10 E11 E12 Name N/C FRM A[0] D[5] VSSOSC VSSIO nMEDCHG/nBROM VDDIO D[9] D[10] PB[5] PB[3] VSSIO TXD[2] RUN/CLKEN VSSIO N/C DD[3] A[1] D[6] VSSRTC BATOK nBATCHG VSSIO D[11] VDDIO PB[1]/PRDY[2] VDDIO TDO PB[4] PB[6] VSSRTC VSSRTC DD[0] D[3] VSSRTC A[7] A[8] A[9] VSSIO D[12] D[13] PA[7] PA[5] VSSIO PA[4] PA[6] Type O O O I/O Oscillator ground LCD frame synchronization pulse System byte address Data I/O PLL ground Description
Core power Digital core power, 2.5V I/O O O O I Pad power I Pad power I Data I/O System byte address System byte address
Pad ground I/O ground I Pad power I/O I/O I I Media change interrupt input / internal rom boot enable Digital I/O power, 3.3V Data I/O Data I/O GPIO port B GPIO port B
System byte address System wake up input Digital I/O power, 3.3V User reset input Digital I/O power, 3.3V Expansion clock input E13 E14 E15 E16 F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 G1 G2 G3 G4 G5 LCD pixel clock out G6 G7 G8 G9 G10 G11 G12 G13 G14 G15 G16 H1 H2 H3 H4 H5
Pad ground I/O ground Pad power Digital I/O power, 3.3V
Pad ground I/O ground O O UART 2 transmit data output Run output / clock enable output
Pad ground I/O ground Pad ground I/O ground Pad ground I/O ground Pad power Digital I/O power, 3.3V
Pad ground I/O ground O O O I/O LCD serial display data System byte address Data I/O
Pad ground I/O ground Pad ground I/O ground Pad ground I/O ground Pad power Digital I/O power, 3.3V
RTC ground Real time clock ground I I Battery ok input Battery changed sense input
Pad ground I/O ground Pad ground I/O ground I I O I Power-on reset input External power supply sense input Transfer direction Expansion port ready input
Pad ground I/O ground I/O Pad power I Pad power O I I Data I/O Digital I/O power, 3.3V GPIO port B / CL-PS6700 interface signal Digital I/O power, 3.3V JTAG data out GPIO port B GPIO port B
Pad ground I/O ground Pad power O O O O Digital I/O power, 3.3V Chip select out ROM, expansion write enable
Core ground Real time clock ground RTC ground Real time clock ground O I/O LCD serial display data Data I/O
Core ground Real time clock ground I/O I I Pad power Data I/O Power fail sense input Main oscillator input Digital I/O power, 3.3V
RTC ground Real time clock ground O O O System byte address System byte address System byte address
Pad ground I/O ground I/O I/O I I I O Data I/O Data I/O UART 2 receive data input GPIO port B JTAG data input Word access select output
Pad ground I/O ground I/O I/O I I Data I/O Data I/O GPIO port A GPIO port A
Pad ground I/O ground O Chip select out
Pad ground I/O ground I I GPIO port A GPIO port A
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location H6 H7 H8 H9 H10 H11 H12 H13 H14 H15 H16 J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 J14 J15 J16 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 K11 K12 K13 K14 K15 K16 L1 L2 L3 L4 L5 Name PB[0]/PRDY[1] PB[2] VSSRTC VSSRTC A[10] A[11] A[12] A[13] VSSIO D[14] D[15] PA[3] PA[1] VSSIO PA[2] PA[0] TXD[1] CTS VSSRTC VSSRTC A[17] A[16] A[15] A[14] nTRST D[16] D[17] LEDDRV PHDIN VSSIO DCD nTEST[1] EINT[3] VSSRTC ADCIN COL[4] TCLK D[20] D[19] D[18] VSSIO VDDIO VDDIO RXD[1] DSR VDDIO nEINT[1] PE[2]/CLKSEL Type I I Description GPIO port B / CL-PS6700 interface signal GPIO port B L8 RTC ground Real time clock ground L9 RTC ground Real time clock ground L10 O O O O System byte address L11 System byte address L12 System byte address L13 System byte address L14 Pad ground I/O ground L15 I/O I/O I I Data I/O L16 Data I/O M1 GPIO port A M2 GPIO port A M3 Pad ground I/O ground M4 I I O I GPIO port A M5 GPIO port A M6 UART 1 transmit data out M7 UART 1 clear to send input M8 RTC ground Real time clock ground M9 RTC ground Real time clock ground M10 O O O O I I/O I/O O I System byte address M11 System byte address M12 System byte address M13 System byte address M14 JTAG async reset input M15 Data I/O M16 Data I/O N1 IR LED drivet N2 Photodiode input N3 Pad ground I/O ground N4 I I I UART 1 data carrier detect N5 Test mode select input N6 External interrupt N7 RTC ground Real time clock ground N8 I O I I/O I/O I/O SSI1 ADC serial input N9 Keyboard scanner column drive N10 JTAG clock N11 Data I/O N12 Data I/O N13 Data I/O N14 Pad ground I/O ground N15 Pad power Pad power I I Pad power I I Digital I/O power, 3.3V N16 Digital I/O power, 3.3V P1 UART 1 receive data input P2 UART 1 data set ready input P3 Digital I/O power, 3.3V P4 External interrupt input P5 GPIO port E / clock input mode select VDDIO Pad power Digital I/O power, 3.3V VSSIO Pad ground I/O ground VSSIO Pad ground I/O ground RTCOUT O Real time clock oscillator output VSSRTC RTC ground Real time clock ground D[23] I/O Data I/O D[22] I/O Data I/O VSSIO Pad ground I/O ground HALFWORD O Halfword access select output D[26] I/O Data I/O D[29] I/O Data I/O COL[2] O Keyboard scanner column drive SMPCLK O SSI1 ADC sample clock ADCCLK O SSI1 ADC serial clock SSIRXDA I/O DAI/CODEC/SSI2 serial data input PD[2] I/O GPIO port D PD[5] I/O GPIO port D VDDIO Pad power Digital I/O power, 3.3V VSSIO Pad ground I/O ground PE[1]/BOOTSEL[1] I GPIO port E / boot mode select nEXTFIQ I External fast interrupt input D[21] I/O Data I/O A[20] O System byte address VDDIO Pad power Digital I/O power, 3.3V A[23] O System byte address VSSIO Pad ground I/O ground D[27] I/O Data I/O COL[0] O Keyboard scanner column drive FB[0] I PWM feedback input DRIVE[1] I/O PWM drive output SSITXFR I/O DAI/CODEC/SSI2 frame sync VDDIO Pad power Digital I/O power, 3.3V TMS I JTAG mode select PE[0]/BOOTSEL[0] I GPIO port E / Boot mode select VDDIO Pad power Digital I/O power, 3.3V nEINT[2] I External interrupt input nTEST[0] I Test mode select input A[19] O System byte address A[18] O System byte address VSSIO Pad ground I/O ground A[21] O System byte address A[22] O System byte address VSSRTC RTC ground Real time clock ground D[31] I/O Data I/O COL[6] O Keyboard scanner column drive VSSRTC Core ground Real time clock ground
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location L6 L7 Name VSSRTC PD[0]/LEDFLSH Type Description
RTC ground Real time clock ground I/O GPIO port D / LED blinker output
DS507F1
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41
EP7309 High-Performance, Low-Power System on Chip
Table 21. 256-Ball PBGA Ball Listing (Continued)
Ball Location P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 P16 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 Name VSSIO VSSIO VDDIO VSSIO VDDIO VSSIO VSSIO VDDIO VSSIO D[24] VDDIO RTCIN VDDIO PD[4] PD[1] SSITXDA nADCCS VDDIO ADCOUT COL[7] COL[3] COL[1] D[30] A[27] A[25] VDDIO A[24] VDDRTC PD[7] PD[6] PD[3] SSICLK SSIRXFR VDDCORE DRIVE[0] FB[1] COL[5] VDDIO BUZ D[28] A[26] D[25] VSSIO Type Pad ground I/O ground Pad ground I/O ground Pad power Digital I/O power, 3.3V Description
Pad ground I/O ground Pad power Digital I/O power, 3.3V
Pad ground I/O ground Pad ground I/O ground Pad power Digital I/O power
Pad ground I/O ground I/O Pad power I/O Pad power I/O I/O O O Pad power O O O O I/O O O Pad power O RTC power I/O I/O I/O I/O - Data I/O Digital I/O power, 3.3V Real time clock oscillator input Digital I/O power, 3.3V GPIO port D GPIO port D DAI/CODEC/SSI2 serial data output SSI1 ADC chip select Digital I/O power, 3.3V SSI1 ADC serial data output Keyboard scanner column drive Keyboard scanner column drive Keyboard scanner column drive Data I/O System byte address System byte address Digital I/O power, 3.3V System byte address Real time clock power, 2.5V GPIO port D GPIO port D GPIO port D DAI/CODEC/SSI2 serial clock DAI/CODEC/SSI2 frame sync
Core power Core power, 2.5V I/O I O Pad power O I/O O I/O PWM drive output PWM feedback input Keyboard scanner column drive Digital I/O power, 3.3V Buzzer drive output Data I/O System byte address Data I/O
Pad ground I/O ground
42
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
JTAG Boundary Scan Signal Ordering
Table 22. JTAG Boundary Scan Signal Ordering
LQFP Pin No.
1 4 5 6 7 8 9 10 13 14 15 16 17 18 19 20 23 24 25 26 27 28 29 30 31 32 34 35 36 37 38 39 40 41 42 43
TFBGA Ball
B3 A2 B1 E3 C1 C2 E2 D2 F3 D1 F2 G3 E1 F1 G2 G1 H3 H1 J3 J2 J1 L3 K2 K1 M3 L2 L1 N3 M2 M1 P3 N1 N2 R3 P1 P2
PBGA Ball
B1 C2 E4 D1 F5 D2 F4 E1 E2 G5 F1 G4 F2 H7 G1 H6 H1 H5 H2 H4 J1 J4 J2 J5 K1 J6 K2 J7 L1 K4 L2 K5 M1 K6 M2 L4
Signal
nCS[5] EXPCLK WORD WRITE RUN/CLKEN EXPRDY TXD2 RXD2 PB[7] PB[6] PB[5] PB[4] PB[3] PB[2] PB[1]/PRDY2 PB[0]/PRDY1 PA[7] PA[6] PA[5] PA[4] PA[3] PA[2] PA[1] PA[0] LEDDRV TXD1 PHDIN CTS RXD1 DCD DSR nTEST1 nTEST0 EINT3 nEINT2 nEINT1
Type
O I/O O O O I O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O O I I I I I I I I I I
Position
1 3 6 8 10 13 14 16 17 20 23 26 29 32 35 38 41 44 47 50 53 56 59 62 65 67 69 70 71 72 73 74 75 76 77 78
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EP7309 High-Performance, Low-Power System on Chip
Table 22. JTAG Boundary Scan Signal Ordering (Continued)
LQFP Pin No.
44 45 46 47 53 54 55 56 59 60 61 62 68 69 70 75 76 77 78 79 80 82 83 84 85 86 87 88 91 92 93 94 95 96 97 99 100 101
TFBGA Ball
T3 R1 R2 T1 T2 V4 W4 Y4 V5 W5 Y5 V6 W6 Y6 W8 Y8 V9 W10 Y10 V11 W11 Y11 Y12 W12 V12 Y13 W13 V13 Y14 W14 A1 V14 Y15 W15 V15 Y16 W16 V16
PBGA Ball
N1 L5 N2 M4 T2 T3 N5 R3 T4 N6 R4 L7 T6 K8 R6 M8 T8 N8 R8 N9 T9 M9 R9 L9 T10 K9 R10 N10 R11 M10 T12 L10 R12 N11 T13 R13 M11 T14
Signal
nEXTFIQ PE[2]/CLKSEL PE[1]/BOOTSEL1 PE[0]/BOOTSEL0 PD[7] PD[6] PD[5] PD[4] PD[3] PD[2] PD[1] PD[0]/LEDFLSH SSIRXFR ADCIN nADCCS DRIVE1 DRIVE0 ADCCLK ADCOUT SMPCLK FB1 FB0 COL7 COL6 COL5 COL4 COL3 COL2 COL1 COL0 BUZ D[31] D[30] D[29] D[28] A[27] D[27] A[26]
Type
I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O O I/O I O I/O I/O O O O I I O O O O O O O O O I/O I/O I/O I/O Out I/O O
Position
79 80 83 86 89 92 95 98 101 104 107 110 122 125 126 128 131 134 136 138 140 141 142 144 146 148 150 152 154 156 158 160 163 166 169 172 174 177
44
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 22. JTAG Boundary Scan Signal Ordering (Continued)
LQFP Pin No.
102 103 104 105 106 109 110 111 112 113 114 115 117 118 119 120 121 122 126 127 128 129 130 131 132 133 134 135 136 137 138 141 142 143 144 145 146 147
TFBGA Ball
Y17 W17 Y18 V17 W18 Y19 W20 U18 V20 U19 U20 T19 T20 R19 R20 T18 P19 P20 R18 N19 N20 P18 M19 N18 L20 L19 M18 K20 K19 K18 J20 J19 H20 H19 J18 K3 Y3 G20
PBGA Ball
N12 R14 T15 N13 R16 P15 M13 N16 L12 N15 L13 M16 M15 K11 L16 K12 L15 K13 J10 J16 J11 J15 J12 H16 J13 H15 H13 G16 H12 G15 H11 F15 H10 E16 G13 E15 G12 D16
Signal
D[26] A[25] D[25] HALFWORD A[24] D[24] A[23] D[23] A[22] D[22] A[21] D[21] A[20] D[20] A[19] D[19] A[18] D[18] A[17] D[17] A[16] D[16] A[15] D[15] A[14] D[14] A[13] D[13] A[12] D[12] A[11] D[11] A[10] D[10] A[9] D[9] A[8] D[8]
Type
I/O O I/O O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O O I/O
Position
179 182 184 187 189 191 194 196 199 201 204 206 209 211 214 216 219 221 224 226 229 231 234 236 239 241 244 246 249 251 254 256 259 261 264 266 269 271
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EP7309 High-Performance, Low-Power System on Chip
Table 22. JTAG Boundary Scan Signal Ordering (Continued)
LQFP Pin No.
148 150 151 152 153 154 155 156 161 162 163 164 165 166 169 170 171 172 173 175 176 177 178 179 184 185 186 187 188 189 191 192 193 194 195 196 199 200
TFBGA Ball
H18 F20 G19 E20 F19 G18 D20 F18 D19 E19 C19 C20 E18 B20 B16 A16 C15 B15 A15 C14 B14 A14 C13 B13 A13 C12 B12 A12 C11 B11 B10 A10 A9 B9 C9 A8 B8 C8
PBGA Ball
G11 D15 F13 C16 F12 C15 E13 B16 B14 D11 A13 F10 B13 E10 B12 D10 A11 G9 B11 A10 F9 B10 E9 A9 D8 B8 E8 A7 F8 B7 A6 G8 B6 D7 A5 E7 F7 A4
Signal
A[7] D[7] nBATCHG nEXTPWR BATOK nPOR nMEDCHG/nBROM nURESET WAKEUP nPWRFL A[6] D[6] A[5] D[5] A[4] D[4] A[3] D[3] A[2] D[2] A[1] D[1] A[0] D[0] CL2 CL1 FRM M DD[3] DD[2] DD[1] DD[0] N/C N/C N/C N/C N/C N/C
Type
O I/O I I I I I I I I O I/O O I/O O I/O O I/O O I/O O I/O O I/O O O O O I/O I/O I/O I/O O O I/O I/O I/O I/O
Position
274 276 279 280 281 282 283 284 285 286 287 289 292 294 297 299 302 304 307 309 312 314 317 319 322 324 326 328 330 333 336 339 342 344 346 349 352 355
46
(c)Copyright Cirrus Logic, Inc. 2005
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Table 22. JTAG Boundary Scan Signal Ordering (Continued)
LQFP Pin No.
201 202 204 205 206 207 208
TFBGA Ball
A7 B7 C7 A6 B6 C6 A5
PBGA Ball
D6 B4 E6 A3 D5 B3 A2
Signal
nMWE nMOE nCS[0] nCS[1] nCS[2] nCS[3] nCS[4]
Type
O O O O O O O
Position
358 360 362 364 366 368 370
1) See EP7309 Users' Manual for pin naming / functionality. 2) For each pad, the JTAG connection ordering is input, output, then enable as applicable.
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EP7309 High-Performance, Low-Power System on Chip
CONVENTIONS
This section presents acronyms, abbreviations, units of measurement, and conventions used in this data sheet.
Table 23. Acronyms and Abbreviations (Continued)
Acronym/ Abbreviation
TAP TLB
Definition
test access port translation lookaside buffer universal asynchronous receiver
Acronyms and Abbreviations
Table 23 lists abbreviations and acronyms used in this data sheet.
Table 23. Acronyms and Abbreviations
UART
Units of Measurement
Table 24. Unit of Measurement
Acronym/ Abbreviation
A/D ADC CODEC D/A DMA EPB FCS FIFO FIQ GPIO ICT IR IRQ IrDA JTAG LCD LED LQFP LSB MIPS MMU MSB PBGA PCB PDA PLL p/u RISC RTC SIR SRAM SSI
Definition
analog-to-digital analog-to-digital converter coder / decoder digital-to-analog direct-memory access embedded peripheral bus frame check sequence first in / first out fast interrupt request general purpose I/O in circuit test infrared standard interrupt request Infrared Data Association Joint Test Action Group liquid crystal display light-emitting diode low profile quad flat pack least significant bit millions of instructions per second memory management unit most significant bit plastic ball grid array printed circuit board personal digital assistant phase locked loop pull-up resistor reduced instruction set computer Real-Time Clock slow (9600-115.2 kbps) infrared static random access memory synchronous serial interface
Symbol
Unit of Measure
degree Celsius sample frequency hertz (cycle per second) kilobits per second kilobyte (1,024 bytes) kilohertz kilohm megabits (1,048,576 bits) per second megabyte (1,048,576 bytes) megabytes per second megahertz (1,000 kilohertz) microampere microfarad microwatt microsecond (1,000 nanoseconds) milliampere milliwatt millisecond (1,000 microseconds) nanosecond volt watt
C
fs Hz kbps KB kHz k Mbps MB MBps MHz A F W s mA mW ms ns V W
48
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
General Conventions
Hexadecimal numbers are presented with all letters in uppercase and a lowercase "h" appended or with a 0x at the beginning. For example, 0x14 and 03CAh are hexadecimal numbers. Binary numbers are enclosed in single quotation marks when in text (for example, `11' designates a binary number). Numbers not indicated by an "h", 0x or quotation marks are decimal. Registers are referred to by acronym, with bits listed in brackets separated by a colon (:) (for example, CODR[7:0]), and are described in the EP7309 User's Manual. The use of "TBD" indicates values that are "to be determined," "n/a" designates "not available," and "n/c" indicates a pin that is a "no connect."
Pin Description Conventions
Abbreviations used for signal directions are listed in Table 25.
Table 25. Pin Description Conventions
Abbreviation
I O I/O Input Output Input or Output
Direction
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EP7309 High-Performance, Low-Power System on Chip
Ordering Information
Model Package Temperature
EP7309-CB EP7309-CBZ (Lead Free) EP7309-CV EP7309-CVZ (Lead Free) EP7309-IB EP7309-IBZ (Lead Free) EP7309-IR
256-pin BGA, 17mm X 17mm 0 to +70 C 208-pin LQFP. 256-pin BGA, 17mm X 17mm 204-pin BGA, 13mm X 13mm.
-40 to +85 C.
Environmental, Manufacturing, & Handling Information
Model Number Peak Reflow Temp 225 C 260 C 225 C 260 C 225 C 260 C 225 C 3 7 Days MSL Rating* Max Floor Life
EP7309-CB EP7309-CBZ (Lead Free) EP7309-CV EP7309-CVZ (Lead Free) EP7309-IB EP7309-IBZ (Lead Free) EP7309-IR
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
50
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DS507F1
EP7309 High-Performance, Low-Power System on Chip
Revision History
Revision PP1 F1 Date NOV 2003 AUG 2005 First preliminary release. Updated SDRAM timing. Added MSL data. Changes
Contacting Cirrus Logic Support
For all product questions and inquiries contact a Cirrus Logic Sales Representative. To find the one nearest to you go to www.cirrus.com
IMPORTANT NOTICE Cirrus Logic, Inc. and its subsidiaries ("Cirrus") believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided "AS IS" without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnification, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES. Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners. SPI is a trademark of Motorola, Inc. Microwire is a trademark of National Semiconductor Corporation. LINUX is a registered trademark of Linus Torvalds. Microsoft Windows and Microsoft are registered trademarks of Microsoft Corporation.
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